行业研究报告

Morgan Stanley-Asia Technology Memory – The Power of Doing Nothing

2024-03半导体芯片26Morgan Stanley

Morgan Stanley Asia Limited+ Shawn.Kim@morganstanley.com +852 3963-1005 Research Associate

报告摘要

Morgan Stanley Asia Limited+ Shawn.Kim@morganstanley.com +852 3963-1005 Research Associate

报告信息

文件全名
Morgan Stanley-Asia Technology Memory – The Power of Doing Nothing.pdf
适合读者
战略规划行业研究员
核心数据
  1. +20% prices hikes amid pocket of demand improvement. NAND contract transaction
  2. prices are rising +10-15% in 2Q24 following a wafer price resurgence in March at
  3. +15% MoM and an improving structural demand environment from enterprise SSD
  4. ahead, we expect Hynix to remain in pole position for HBM3e with more than 90%
核心议题
DRAMNAND

常见问题

《Morgan Stanley-Asia Technology Memory – The Power of Doing Nothing》主要包含哪些内容?

Morgan Stanley Asia Limited+ Shawn.Kim@morganstanley.com +852 3963-1005 Research Associate核心数据:+20% prices hikes amid pocket of demand improvement. NAND contract transaction;prices are rising +10-15% in 2Q24 following a wafer price resurgence in March at;+15% MoM and an improving structural demand environment from enterprise SSD。

这份报告由哪家机构发布?

本报告由Morgan Stanley发布,发布于 2024 年。

这份报告覆盖哪一年、篇幅多大?

覆盖 2024 年,全文约 26。

这份报告是免费的吗?如何获取?

本报告免费查阅,登录资料宝后即可在线获取完整内容。

这份报告适合哪些读者?

适合战略规划、行业研究员等读者参考。

报告涉及哪些关键议题?

重点分析了DRAM、NAND等议题。

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